Topscom Technology

Company Description

Plastic molding and injection Sheet metal stamping and punching Painting lines Die-casting lines Powder coating lines Silkscreen and pad printingHigh-speed SMT and DIP assemblyWe are capable of providing cost effective and high-quality vertical manufacturing services from PCB assembly to final case assembly:Chip-on-board (COB) Surface-mount technology (SMT) Ball-grid array (BGA) Through-holePrimary competitive advantages:Profound knowledge of contract manufacturing services Capable of developing effective production process to ensure high-quality and consistency Experienced logistics management Cost-effective factory located in mainland China Able to handle small as well as large volume production with flexibilityWe also had launched six Sigma DMAIC program since January 2002Our building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medicals, networking, peripherals and telecommunications