AMC Co., Ltd.
Company Description
Established in 1996, AMC Co., Ltd. has been manufacturing and supplying the tape for semiconductor companies all over the world. Our main product is semiconductor tape used in processing the semiconductor wafer for backgrinding and dicing.- 2004 Perform SMBA Innovation Mission (Sole)-Completed.- 2004 Perform CIE Part & Material Mission( Joint)-Completed.- 2005 Perform SMBA Innovation Strategy Mission (Joint) -Completed- 2005 Perform CIE Part & Material Innovation Mission (Joint)-Completed- 2005 Commission of Specialist of Part & Materials against Korea & Japan FTA- 2007 Nominated as Part and Materials Mission by CIE- 2009 Perform CIE Part & Material Mission -Completed
Contact info
- Contact Person: Kyeong-uk Kim
- Job Title: Manager
- Telephone:
- Mobilephone:
- Fax Number:
Related Product
- Back Grind Adhesive Tape
- Dicing Adhesive Tape
- Package Dicing Adhesive Tape
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